A huge amount of blood bottles in hospitals have to be disposed every year since the proper storage temperature could not be guaranteed. Also for refrigerator cargo it is important to know if the temperate chain was broken during the transport. Several temperature indicator labels are available on the market that commonly bases on chemical reactions and color change or darkening. But they lack the possibility of an easy, cost efficient, and low-energy readout. Furthermore, they have issues with their long-term stability. Therefore, novel approaches for miniaturized passive sensor systems for the observation of threshold temperatures are necessary. Ideally, such systems are a combination of an RFID tag with an antenna for readout and power transmission, a capacitor device to storage the power during the readout, and a transducer device including an evaluation circuits. The aim of the work is the design and a proof of concept of a passive temperature transducer, which is envisioned as micro-electro-mechanical system. It composes of two parts: A thermal actuator, and a latching mechanism. The thermal actuator converts thermal energy, due to a change in the temperature of the cargo, into mechanical energy. This mechanical energy is applied to a latching mechanism. At a specific threshold temperature, the latching mechanism hooks with its counterpart and irreversible changes the state of the device. A sophisticated design allows for production, transport, and storage of the devices at ambient or raised temperatures. Once it is activated at lower temperatures, an exceeding of a specific threshold temperature can be recorded even when the cargo is cooled down again. The transducer element is completely passive and does not need any power supply during the monitoring of the transport chain. Pursuing the goal of a single unit package, it will be considered whether the RFID-antenna and perhaps even the capacitor and readout circuit could be manufactured together with the MEMS-transducer on the same chip. This is a boundary condition for the manufacturing of the MEMS subsystem. Hence, only standard CMOS compatible manufacturing process are applied for the fabrication of the device.