Name Card

Full name Familienname, Vorname
Walter, Thomas
 
Main Affiliation Organisations­zuordnung
 

Own Publications Eigene Publikationen


Results 1-20 of 22 (Search time: 0.003 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Walter, Thomas Hochbeschleunigte Lebensdauerprüfung für elektronische BauteilePresentation Vortrag14-Nov-2023
2Walter-2023-Microelectronics Reliability-vor.pdf.jpgWalter, Thomas ; Khatibi, G. ; Betzwar Kotas, A. ; Kretschy, Nicole In-situ delamination detection in multi-layered semiconductor packagesArticle Artikel Nov-2023
3Khatibi Damavandi, Golta ; Walter, Thomas Beschleunigte Prüfmethode für Lotverbindungen in der ElektronikSpecial Contribution SpezialbeitragSep-2023
4Hartleb, Moritz ; Imrich , Peter ; Zechner, Johannes ; Walter, Thomas ; Khatibi Damavandi, Golta Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor componentsInproceedings Konferenzbeitrag6-Jul-2023
5Walter, Thomas ; Khatibi Damavandi, Golta In-situ Delaminationsmessung in Mehrlagenstrukturen der ElektronikInproceedings KonferenzbeitragJun-2023
6Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas Alternative POF-Based Accelerated TestingPresentation Vortrag18-Apr-2023
7Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas ; Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Zareghomsheh, Mohammad PoF Based Accelerated TestingPresentation VortragJun-2022
8Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi Damavandi, Golta ; Popok, Vladimir ; Kristensen, Peter Kjær ; Boturchuk, Ievgen ; Schwarz, Sabine Interfacial adhesion strength of III-N heterostructuresArticle Artikel Jan-2022
9Lederer, Martin ; Walter, Thomas ; Khatibi, Golta Modelling of Cyclic Delamination Behavior of Thin Multilayered Structures Using Gradient Elasticity and Damage AccumulationArtikel Article Jan-2021
10Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi, Golta ; Popok, Vladimir ; Kristensen, Peter ; Schwarz, Sabine Interfacial adhesion strength of III-N heterostructuresPräsentation Presentation2021
11Lederer, M ; Walter, T ; Zareghomsheh, M ; Khatibi, G Delamination Criteria for SiN/TiW Interfaces Tested by Cross-Sectional Nanoidentation and by Four Point BendingKonferenzbeitrag Inproceedings2021
12Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi, Golta ; Danninger, Herbert Adhesion properties of thin film multilayers: Comparison of nanoindentation and four-point-bending techniquesArtikel Article 2021
13Walter, Thomas Methods for evaluation of thin film adhesion in power electronicsPräsentation Presentation2019
14Boturchuk, Ievgen ; Walter, Thomas ; Julsgaard, Brian ; Khatibi, Golta ; Schwarz, Sabine ; Stöger-Pollach, Michael ; Pedersen, Kjeld ; Popok, Vladimir N. Structure and properties of Ta/Al/Ta and Ti/Al/Ti/Au multilayer metal stacks formed as ohmic contacts on n-GaNArtikel Article 2019
15Walter, Thomas ; Khatibi, Golta Cyclic delamination behaviour of thin film multilayersPräsentation Presentation2019
16Walter, Thomas ; Khatibi, Golta ; Nelhiebel, Michael ; Steffeneli, Mario Characterization of cyclic delamination behavior of thin film multilayersArtikel Article 1-Oct-2018
17Gökdeniz, Z.G. ; Khatibi, Golta ; Walter, Thomas ; Nicolics, Johann Temperature Dependent Mechanical Properties of Sintered Silver-Copper JointsKonferenzbeitrag Inproceedings 2018
18Brincker, Mads ; Walter, Thomas ; Kristensen, Peter K. ; Popok, Vladimir N. Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallizationArtikel Article 2017
19Walter, T. ; Lederer, M. ; Khatibi, G. Delamination of polyimide/Cu films under mixed mode loadingArtikel Article 2016
20Walter, T. ; Khatibi, G. ; Nelhiebel, M. ; Heinz, W. ; Robl, W. High cycle fatigue properties of Cu filmsArtikel Article2015

Contributing Publications Mitbeteiligte Publikationen


Results 1-1 of 1 (Search time: 0.003 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Adlim Dilan - 2021 - Adhesion properties of Cu-multilayers in electronic devices.pdf.jpgAdlim, Dilan Adhesion properties of Cu-multilayers in electronic devicesThesis Hochschulschrift 2021