Name Card

Full name Familienname, Vorname
Khatibi Damavandi, Golta
 
Main Affiliation Organisations­zuordnung
 

Own Publications Eigene Publikationen

Results 1-20 of 35 (Search time: 0.004 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Wodak-2023-Applied Nanoscience-vor.pdf.jpgWodak, Irina ; Yakymovych, Andriy ; Svec, Peter ; Orovcik, Lubomir ; Khatibi, Golta Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder jointsArticle Artikel Nov-2023
2Walter-2023-Microelectronics Reliability-vor.pdf.jpgWalter, Thomas ; Khatibi, G. ; Betzwar Kotas, A. ; Kretschy, Nicole In-situ delamination detection in multi-layered semiconductor packagesArticle Artikel Nov-2023
3Wodak, Irina ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Khatibi Damavandi, Golta Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped FluxPresentation Vortrag25-Oct-2023
4Khatibi Damavandi, Golta ; Czerny, Bernhard Lebensdauerprognose von IGBT-Modulen in Rekordzeit mit BAMFIT-BondtesterSpecial Contribution SpezialbeitragOct-2023
5Wodak, Irina ; Khatibi Damavandi, Golta ; Yakymovych, Andriy Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticlesPresentation VortragOct-2023
6Khodabakhshi, Farzad ; Khatibi Damavandi, Golta Graphene and carbon nanotubes functionality in Sn-Ag-Cu solder alloyPresentation Vortrag7-Sep-2023
7Khatibi Damavandi, Golta ; Walter, Thomas Beschleunigte Prüfmethode für Lotverbindungen in der ElektronikSpecial Contribution SpezialbeitragSep-2023
8Delshadmanesh, Mitra ; Lederer, Martin ; Frank, Johannes ; Khatibi Damavandi, Golta Study of fatigue life and fatigue notch sensitivity of biocompatible Co-Cr alloy L605Inproceedings KonferenzbeitragSep-2023
9Wodak, Irina ; Yakymovych, Andriy ; Khatibi, Golta Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped FluxInproceedings Konferenzbeitrag6-Jul-2023
10Hartleb, Moritz ; Imrich , Peter ; Zechner, Johannes ; Walter, Thomas ; Khatibi Damavandi, Golta Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor componentsInproceedings Konferenzbeitrag6-Jul-2023
11Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped FluxInproceedings Konferenzbeitrag6-Jul-2023
12Walter, Thomas ; Khatibi Damavandi, Golta In-situ Delaminationsmessung in Mehrlagenstrukturen der ElektronikInproceedings KonferenzbeitragJun-2023
13Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas Alternative POF-Based Accelerated TestingPresentation Vortrag18-Apr-2023
14Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi, G. Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element AnalysisArticle Artikel Mar-2023
15Yakymovych, Andriy ; Goh, Yingxin ; Kamaruzzaman L.S. ; Wodak, Irina ; Khatibi Damavandi, Golta Hybrid solder joints: Effects of Fe nanoparticle-doped flux on morphology and hardness of SAC305 solder jointsInproceedings Konferenzbeitrag2023
16Zareghomsheh, Mohammad ; Khatibi, Golta The Activation Energy of Strain Bursts during Nanoindentation Creep on PolyethyleneArticle Artikel 23-Dec-2022
17Wodak, Irina ; Yakymovych, Andriy ; Strutz, Patricia ; Wimmer, C. ; Syrym, Yerbol ; Khatibi Damavandi, Golta Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder jointsInproceedings KonferenzbeitragAug-2022
18Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas ; Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Zareghomsheh, Mohammad PoF Based Accelerated TestingPresentation VortragJun-2022
19Lederer, Martin ; Gökdeniz, Zeynep Gökce ; Khatibi Damavandi, Golta ; Nicolics, Johann Temperaturabhängigkeit mechanischer Eigenschaften von Niedertemperatur-Silber-Sinterschichten und deren Modellierung für die Nutzung in FiniteElemente-SimulationenInproceedings KonferenzbeitragJun-2022
20Khatibi Damavandi, Golta Reliability Assessment of Thin Films and Multilayers in Electronic PackagesPresentation Vortrag26-May-2022

Contributing Publications Mitbeteiligte Publikationen

Results 1-3 of 3 (Search time: 0.004 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Goekdeniz Zeynep Goekce - 2023 - Reliability of silver sintered large are joints...pdf.jpgGökdeniz, Zeynep Gökce Reliability of silver sintered large area joints : temperature dependent mechanical properties under static and cyclic loadingThesis Hochschulschrift 2023
2Adlim Dilan - 2021 - Adhesion properties of Cu-multilayers in electronic devices.pdf.jpgAdlim, Dilan Adhesion properties of Cu-multilayers in electronic devicesThesis Hochschulschrift 2021
3Delshadmanesh Mitra - 2018 - Fatigue investigations of metallic biomaterials...pdf.jpgDelshadmanesh, Mitra Fatigue investigations of metallic biomaterials based on Ti-Nb and Co-CrThesis Hochschulschrift 2018